UEMCON 2017

IEEE UEMCON 2017

Date – 19th – 21stOctober 2017

Venue – Columbia University, New York City, NY, USA

 

Introduction:

The 8th IEEE Annual Ubiquitous Computing, Electronics & Mobile Communication  Conference IEEE UEMCON 2017 will provide an opportunity for researchers, educators and students to discuss and exchange ideas on issues, trends, and developments in Computing, Electronics and Mobile Communication. The conference aims to bring together scholars from different disciplinary backgrounds to emphasize dissemination of ongoing research in the fields of in Computing, Electronics and Mobile Communication. Contributed papers are solicited describing original works in the above mentioned fields and related technologies. The conference will include a peer-reviewed program of technical sessions, special sessions, business application sessions, tutorials, and demonstration sessions. All accepted papers will be presented during the parallel sessions of the Conference and papers will be submitted for publication at IEEE Xplore Digital Library.

There will be a participation of around 40 countries worldwide with more than 300 researchers/academicians/industry representatives and students. This conference is financially and technically sponsored by IEEE USA, IEEE New York Section, IEEE Region 1, Institute of Engineering Management & University of Engineering Management.

This conference will also promote an intense dialogue between academia and industry to bridge the gap between academic research, industry initiatives, and governmental policies. This is fostered through panel discussions, keynotes, invited talks and industry exhibits where academia is exposed to state-of-practice and results from trials and interoperability experiments. The industry in turn benefits by exposure to leading-edge research in networking as well as the opportunity to communicate with academic researchers regarding practical problems that require further research.

Keynote Speakers:

       The Keynote Speakers In this conference are from various fields and from renowned universities. They are:

  • Fredric M. Ham (Tricorp Business Solutions)
  • Joseph Finkelstein (Center for Bioinformatics and Data Analytics)
  • Lanier Watkins (Johns Hopkins University)
  • Robert Mitchell (Sandia National Laboratories)
  • Eric Balster (University of Dayton)
  • James Cole (University of Tsukuba )
  • Lutz Sparowitz (Technical University of Graz)
  • Robert Steele (Florida Polytechnic University’s Health Informatics Institute)

 

Committee Members:

STEERING COMMITTEE

  • Charles Rubenstein (IEEE-USA)

General Chair

  • Son Vuong (University of British Columbia)

Technical Program Co-Chairs

  • Satyajit Chakrabarti (Institute of Engineering and Management)
  • Supriyo Bandyopadhyay (Virginia Commonwealth University)
  • Himadri Nath Saha (Institute of Engineering and Management)

Publicity Chair

  • Himadri Nath Saha (Institute of Engineering and Management)

TECHNICAL COMMITTEE

  • Jay Chandra (Wayne State University)
  • Ke-Lin Du ( Concordia University )
  • Sotirios Ziavras (New Jersey Institute of Technology)
  • Marc Cahay (University of Cincinnati)
  • Sanjay Banerjee (University of Texas)
  • Zhenliang Zhang (Columbia University)
  • Arnab Bose (University of Chicago)
  • Hamed Aly ( Acadia University )
  • Mustapha Yagoub (University of Ottawa)
  • Myungchul Kim (Korea Advanced Institute of Science and Technology)
  • Parimala Thulasiraman (University of Manitoba )
  • Rishabh Dudheria  (New York Institute of Technology)
  • Edward Chlebus ( Illinois Institute of Technology )
  • Paul Moon ( Rensselaer Polytechnic Institute)
  • Rasit Eskicioglu (University of Manitoba)
  • Russ Miller (University at Buffalo)
  • Gruia Calinescu (Illinois Institute of Technology)
  • Stéphane Zuckerman (University of Delaware)

And several other spanning across the globe.

 

Paper statistics for conference:

 

 

Active(has manuscript)

 

Pending(has manuscript)

 

Accepted

 

Withdrawn

 

Rejected

 

Published

 

Total Valid

 

Acceptance Ratio(%,including revisions)

 

0

 

0 151 25 279 0 430 35.1

Track Statistics:

 

Track

 

Active(has manuscript)

 

Pending(has manuscript)

 

Accepted

 

Withdrawn

 

Rejected

 

Published

 

Total Valid

 

Acceptance Ratio(%,including revisions)

 

UEMCON Paper(Poster Paper)

 

 

0

 

0

 

13

 

1

 

6

 

0

 

19

 

68.4

 

UEMCON Paper(Regular Research Paper)

 

 

0

 

0

 

114

 

18

 

270

 

0

 

384

 

29.7

 

UEMCON Paper(Short Paper-Work in progress)

 

 

0

 

0

 

24

 

6

 

3

 

0

 

27

 

88.9

 

Accepted paper statistics (By Countries):

 

 

Country

 

 No of Accepted Papers
 

USA

 

88

 

India

 

22

 

Pakistan

 

6

 

Canada

 

 

4

China

 

6
Egypt

 

4

 

Morocco

 

2
Mexico

 

2

 

 

Other countries

 

 

17

 

Benefit to the Institutes (IEM & UEM):

  • The IEEE UEMCON 2017 will help the students and faculty to publish their research papers in IEEE Xplore Digital Library.
  • The University can collaborate with other universities for research or technology exchange.
  • Students will get a chance of a foreign internship programme which will automatically enhance their employment opportunity.
  • Along with the students, the faculties will also get a foreign exposure in leading Universities and labs.

 

Benefit to the country:

  • In a broader sense this conference will help our country to collaborate research work with other countries which will create job opportunities for the talented students
  • This is a platform where our country can showcase its talent to other countries.
  • Interaction between eminent professors and technologists open up new avenues and sources of the think tank
  • In the national scenario these conferences are capable of giving new directions to the already

existing work being done on the particular areas.

  • In the field of nation building in economics, education, social & scientific developments, the

new findings of these conferences do lighten up dark dubious areas.